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Author Kong, Joonho ♦ Chung, Sung Woo ♦ Skadron, Kevin
Source ACM Digital Library
Content type Text
Publisher Association for Computing Machinery (ACM)
File Format PDF
Copyright Year ©2012
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword Thermal management ♦ Microprocessor ♦ Performance and reliability
Abstract Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent thermal management techniques for microprocessors, focusing on those that affect or rely on the microarchitecture. We categorize thermal management techniques into six main categories: temperature monitoring, microarchitectural techniques, floorplanning, OS/compiler techniques, liquid cooling techniques, and thermal reliability/security. Temperature monitoring, a requirement for Dynamic Thermal Management (DTM), includes temperature estimation and sensor placement techniques for accurate temperature measurement or estimation. Microarchitectural techniques include both static and dynamic thermal management techniques that control hardware structures. Floorplanning covers a range of thermal-aware floorplanning techniques for 2D and 3D microprocessors. OS/compiler techniques include thermal-aware task scheduling and instruction scheduling techniques. Liquid cooling techniques are higher-capacity alternatives to conventional air cooling techniques. Thermal reliability/security issues cover temperature-dependent reliability modeling, Dynamic Reliability Management (DRM), and malicious codes that specifically cause overheating. Temperature-related issues will only become more challenging as process technology continues to evolve and transistor densities scale up faster than power per transistor scales down. The overall objective of this survey is to give microprocessor designers a broad perspective on various aspects of designing thermal-aware microprocessors and to guide future thermal management studies.
ISSN 03600300
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2012-06-01
Publisher Place New York
e-ISSN 15577341
Journal ACM Computing Surveys (CSUR)
Volume Number 44
Issue Number 3
Page Count 42
Starting Page 1
Ending Page 42


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Source: ACM Digital Library