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Author Toney, M. F. ♦ Howard, J. N. ♦ Richer, J. ♦ Borges, G. L. ♦ Gordon, J. G. ♦ Melroy, O. R. ♦ Yee, D. ♦ Sorensen, L. B.
Source United States Department of Energy Office of Scientific and Technical Information
Content type Text
Language English
Subject Keyword MATERIALS SCIENCE ♦ PHYSICS ♦ COPPER ♦ ELECTROCHEMICAL COATING ♦ ADSORPTION ♦ ELECTROCHEMISTRY ♦ ELECTROLYSIS ♦ GOLD ♦ INTERFACES ♦ MICROSTRUCTURE ♦ MORPHOLOGY ♦ SULFURIC ACID ♦ X-RAY DIFFRACTION
Abstract The structure of electrochemically deposited submonolayer Cu on Au(111) in sulfuric acid has been extensively investigated but is still poorly known. We report an x-ray scattering determination of this structure that explains existing data. The Cu adatoms form a honeycomb lattice and are adsorbed on threefold hollow sites, while sulfate anions occupy the honeycomb centers. Three oxygens of each sulfate bond to Cu atoms. This stabilizes the structure and illustrates that anion effects can be important in electrodeposited structures. Our results indicate that previous scanning tunneling and atomic force microscopy measurements imaged the sulfate molecules not the Cu atoms. {copyright} {ital 1995 The American Physical Society.}
ISSN 00319007
Educational Use Research
Learning Resource Type Article
Publisher Date 1995-12-01
Publisher Place United States
Journal Physical Review Letters
Volume Number 75
Issue Number 24


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