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Author Colbourne, P.D. ♦ Cassidy, D.T.
Sponsorship IEEE Lasers and Electro-Optics Society
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1965
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Bonding ♦ Stress measurement ♦ Polarization ♦ Thermal stresses ♦ Superluminescent diodes ♦ Heat sinks ♦ Tin ♦ Silicon carbide ♦ Current measurement ♦ Mechanical variables measurement
Abstract Mechanical stress induced by bonding AlGaAs superluminescent diodes to Cu, SiC, or diamond heat sinks using 40% Pb-60% Sn or 80% Au-20% Sn solder has been observed using measurements of the degree of polarization of the facet emission at low current levels. Stresses up to 10/sup 9/ dyn/cm/sup 2/ were observed, with the magnitude of the stress dependent on the solder used, and the sign of the stress dependent on the difference in thermal expansion coefficient between the diode and the heat sink. Relaxation of the bonding stress over time was investigated as a function of temperature for each solder. The implications of the relaxation for the interpretation of high-temperature life tests, of superluminescent and laser diodes are discussed.<<ETX>>
Description Author affiliation :: Dept. of Eng. Phys., McMaster Univ., Hamilton, Ont., Canada
ISSN 00189197
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1991-04-01
Publisher Place U.S.A.
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Volume Number 27
Issue Number 4
Size (in Bytes) 760.14 kB
Page Count 7
Starting Page 914
Ending Page 920


Source: IEEE Xplore Digital Library