Thumbnail
Access Restriction
Subscribed

Author Zhuravel, A.P. ♦ Anlage, S.M. ♦ Ustinov, A.V.
Sponsorship Council on Superconductivity ♦ Appl. Superconductivity Conference Inc ♦ MIT
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2002
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Superconducting microwave devices ♦ Microwave imaging ♦ Microscopy ♦ Superconducting devices ♦ Superconducting transmission lines ♦ Masers ♦ Microwave theory and techniques ♦ Superconducting thin films ♦ Strips ♦ Planar transmission lines ♦ nonlinearity ♦ High-${\rm T}_{\rm c}$ superconductors ♦ intermodulation ♦ laser scanning microscopy ♦ microwave devices
Abstract The technique of low-temperature laser scanning microscopy (LSM) has been applied to the investigation of local microwave properties in operating YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7</sub>/LaAlO<sub>3</sub> thin-film resonators patterned into a meandering strip transmission line. By using a modified newly developed procedure of spatially-resolved complex impedance partition, the influence of inhomogeneous current flow on the formation of nonlinear (NL) microwave response in such planar devices is analysed in terms of the independent impact from resistive and inductive components. The modified procedure developed here is dramatically faster than our previous method. The LSM capability to probe the spatial variations of two-tone, third-order intermodulation photoresponse on micron length scales is used to find the 2D distribution of the local sources of microwave NL. The results show that the dominant sources of microwave NL are strongly localized in the resistive domains.
Description Author affiliation :: Ukraine Nat. Acad. of Sci., Kharkov
ISSN 10518223
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-06-01
Publisher Place U.S.A.
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Volume Number 17
Issue Number 2
Size (in Bytes) 963.64 kB
Page Count 4
Starting Page 902
Ending Page 905


Source: IEEE Xplore Digital Library