|Author||Myung Jin Yim ♦ Chang-Kyu Chung ♦ Kyung Wook Paik|
|Sponsorship||IEEE Components, Packaging, and Manufacturing Technology Society ♦ International Microelectronics Assembly and Packaging Society (IMAPS)|
|Source||IEEE Xplore Digital Library|
|Publisher||Institute of Electrical and Electronics Engineers, Inc. (IEEE)|
|Subject Domain (in DDC)||Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics|
|Subject Keyword||Anisotropic conductive films ♦ Electric resistance ♦ Mechanical factors ♦ Scanning electron microscopy ♦ Material properties ♦ Conductivity ♦ Materials reliability ♦ Gold ♦ Polymers ♦ Conductive films ♦ reliability ♦ Anisotropic conductive film (ACF) ♦ chip on glass (COG) ♦ contact resistance ♦ failure analysis|
|Abstract||This paper describes how the material properties of conductive particles in anisotropic conductive films (ACFs) affect the electrical conductivity and the reliability of ACF interconnections for chip-on-glass (COG) applications. For the conductive particles, Au/Ni-coated polymer particles with a 5-diameter were used. Two different types of conductive particles were characterized with respect to their mechanical and electrical properties, such as ball hardness, recovery behavior, and electrical resistance. In addition, two ACFs were fabricated in the form of a double-layered structure, in which the thickness of the ACF and a nonconductive film (NCF) layer were optimized to have as many conductive particles as possible on the bump after COG bonding. The electrical contact resistance of an ACF interconnection in a COG structure depends mainly on the electrical properties of conductive particles in the ACF. The electrical reliability of an ACF interconnection in a COG structure also depends more on the electrical properties than the mechanical properties of conductive particles under a high-temperature and humid condition. Conductive particles with a lower electrical resistance, higher mechanical hardness, and lower recovery rate show better reliability than conductive particles with a higher electrical resistance, lower mechanical hardness, and higher recovery rate. Cross-sectional scanning electron microscopic (SEM) pictures of a COG interconnection show the deformation of two different conductive particles after the reliability tests. The ACF interconnections in the edge or corner of a driver IC show less reliable joints due to high absorption of moisture.|
|Description||Author affiliation :: Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA|
|Education Level||UG and PG|
|Learning Resource Type||Article|
|Rights Holder||Institute of Electrical and Electronics Engineers, Inc. (IEEE)|
|Size (in Bytes)||1.35 MB|
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