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Author Yen, Yee Wen ♦ Chou, Weng Ting ♦ Tseng, Yu ♦ Lee, Chiapyng ♦ Hsu, Chun Lei
Source SpringerLink
Content type Text
Publisher Springer US
File Format PDF
Copyright Year ©2007
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Chemistry & allied sciences
Subject Keyword Dissolution behavior ♦ intermetallic compound (IMC) ♦ dissolution mechanism ♦ grain boundary ♦ lattice diffusion ♦ Solid State Physics and Spectroscopy ♦ Electronics and Microelectronics, Instrumentation ♦ Characterization and Evaluation of Materials ♦ Optical and Electronic Materials
Abstract This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the intermetallic compound (IMC)-Ag$_{3}$Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn (in wt.%) at 300, 270 and 240°C. The dissolution rates of both Cu and Ag in molten solder follow the order Sn > Sn-3.0Ag-0.5Cu >Sn-58Bi > Sn-9Zn. Planar Cu$_{3}$Sn and scalloped Cu$_{6}$Sn$_{5}$ phases in Cu/solders and the scalloped Ag$_{3}$Sn phase in Ag/solders are observed at the metallic substrate/solder interface. The dissolution mechanism is controlled by grain boundary diffusion. The planar Cu$_{5}$Zn$_{8}$ layer formed in the Sn-9Zn/Cu systems. AgZn$_{3}$, Ag5Zn$_{8}$ and AgZn phases are found in the Sn-9Zn/Ag system and the dissolution mechanism is controlled by lattice diffusion. Massive Ag$_{3}$Sn phases dissolved into the solders and formed during solidification processes in the Ag$_{3}$Sn/Sn or Sn-3.0Ag-0.5Cu systems. AgZn$_{3}$ and Ag$_{5}$Zn$_{8}$ phases are formed at the Sn-9Zn/Ag$_{3}$Sn interface. Zn atoms diffuse through Ag-Zn IMCs to form (Ag, Zn)Sn$_{4}$ and Sn-rich regions between Ag$_{5}$Zn$_{8}$ and Ag$_{3}$Sn.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-09-22
Publisher Place Boston
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 37
Issue Number 1
Page Count 11
Starting Page 73
Ending Page 83

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Source: SpringerLink