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Author Naoe, Kazuaki ♦ Nishiki, Masashi ♦ Sato, Keishi
Source SpringerLink
Content type Text
Publisher Springer US
File Format PDF
Copyright Year ©2014
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword aerosol deposition method ♦ alumina ♦ bonding mechanism ♦ electron energy-loss spectroscopy ♦ metal-ceramic interface ♦ Surfaces and Interfaces, Thin Films ♦ Tribology, Corrosion and Coatings ♦ Characterization and Evaluation of Materials ♦ Operating Procedures, Materials Treatment ♦ Analytical Chemistry
Abstract Aerosol deposition method is a technique to form dense films by impacting solid particles on a substrate at room temperature. To clarify the bonding mechanism between AD films and substrates, TEM observation and electron energy-loss spectroscopy (EELS) analysis of the interface between Al$_{2}$O$_{3}$ AD films and Cu substrates were conducted. The Al$_{2}$O$_{3}$ film was directly adhered to the Cu substrate without any void or crack. The film was composed of randomly oriented α-Al$_{2}$O$_{3}$ crystal grains of about 10-20 nm large. At the Al$_{2}$O$_{3}$/Cu interface, the lattice fringes of the film were recognized, and no interfacial layer with nanometer-order thickness could be found. EELS spectra near O-K edge obtained at the interface had the pre-peak feature at around 528 eV. According to previously reported experiments and theoretical calculations, this suggests interactions between Cu and O in Al$_{2}$O$_{3}$ at the interface. It is inferred that not only the anchoring effect but also the ionic bonding and covalent bonding that originates from the Cu-O interactions contribute to the bonding between Al$_{2}$O$_{3}$ AD films and Cu substrates.
ISSN 10599630
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-10-23
Publisher Place Boston
e-ISSN 15441016
Journal Journal of Thermal Spray Technology
Volume Number 23
Issue Number 8
Page Count 6
Starting Page 1333
Ending Page 1338

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Source: SpringerLink