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Author Garimella, N. ♦ Ode, M. ♦ Ikeda, M. ♦ Murakami, H. ♦ Sohn, Y. H.
Source SpringerLink
Content type Text
Publisher Springer US
File Format PDF
Copyright Year ©2009
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics
Subject Keyword high-temperature alloys ♦ intermetallics ♦ L1$_{2}$ ♦ Ni$_{3}$Al ♦ Re ♦ ternary interdiffusion ♦ Metallic Materials ♦ Ceramics, Glass, Composites, Natural Methods ♦ Engineering Thermodynamics, Heat and Mass Transfer ♦ Materials Science ♦ Thermodynamics ♦ Crystallography
Abstract Ternary interdiffusion in L1$_{2}$-Ni$_{3}$Al with ternary alloying addition of Re was investigated at 1473 K using solid-to-solid diffusion couples. Interdiffusion flux of Ni, Al, and Re were directly calculated from experimental concentration profiles and integrated for the determination of average ternary interdiffusion coefficients. The magnitude of main interdiffusion coefficients $ \bar{\tilde{D}}_{\text{NiNi}}^{\text{Al}} $ and $ \bar{\tilde{D}}_{\text{AlAl}}^{\text{Ni}} $ was determined to be much larger than that of the main interdiffusion coefficient $ \bar{\tilde{D}}_{\text{ReRe}}^{\text{Al (or Ni)}}. $ A moderate tendency for Re to substitute for Al sites was reflected by its influence on interdiffusion of Al, quantified by large and positive $ \bar{\tilde{D}}_{\text{AlRe}}^{\text{Ni}} $ coefficients. Similar trends were observed from ternary interdiffusion coefficients determined by Boltzmann-Matano analysis. Profiles of concentrations and interdiffusion fluxes were also examined to estimate binary interdiffusion coefficients in Ni$_{3}$Al, and tracer diffusion coefficients of Re (5.4 × 10$^{−16}$ ± 2.3 × 10$^{−16}$ m$^{2}$/s) in Ni$_{3}$Al.
ISSN 15477037
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2009-04-09
Publisher Place Boston
e-ISSN 18637345
Journal Journal of Phase Equilibria and Diffusion
Volume Number 30
Issue Number 3
Page Count 8
Starting Page 246
Ending Page 253


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Source: SpringerLink