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Author Han, Y.D. ♦ Jing, H.Y. ♦ Nai, S.M.L. ♦ Xu, L.Y. ♦ Tan, C.M. ♦ Wei, J.
Source SpringerLink
Content type Text
Publisher Springer US
File Format PDF
Copyright Year ©2009
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword Lead-free solder ♦ creep ♦ hardness ♦ nanoindentation ♦ Solid State Physics ♦ Electronics and Microelectronics, Instrumentation ♦ Characterization and Evaluation of Materials ♦ Optical and Electronic Materials
Abstract The creep behavior and hardness of Sn-3.5Ag-0.7Cu solder were studied using Berkovich depth-sensing indentation at temperatures of 25°C to 125°C. Assuming a power-law relationship between the creep strain rate and stress, an activation energy of 40 kJ/mol and stress exponents of 7.4, 5.5, and 3.7 at 25°C, 75°C, and 125°C, respectively, were obtained. The results revealed that, with increasing temperature, the creep penetration and steady-state creep strain rate increased whereas the stress exponent decreased. The stress exponent and activation energy results also suggested that the creep mechanism is dislocation climb, assisted by diffusion through dislocation cores in Sn. Furthermore, the hardness results exhibited a decreasing trend with increasing temperature, which is attributed to softening at high temperature.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2009-11-05
Publisher Place Boston
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 39
Issue Number 2
Page Count 7
Starting Page 223
Ending Page 229

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Source: SpringerLink