Thumbnail
Access Restriction
Subscribed

Author Lin, Kwang Lung ♦ Hsu, Hui Min
Source SpringerLink
Content type Text
Publisher Springer-Verlag
File Format PDF
Copyright Year ©2001
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Chemistry & allied sciences
Subject Keyword Pb-free solder ♦ diffusion barrier ♦ intermetallic ♦ interdiffusion ♦ Cu contact ♦ Sn-Zn-Al ♦ Optical and Electronic Materials ♦ Characterization and Evaluation of Materials ♦ Electronics and Microelectronics, Instrumentation ♦ Solid State Physics and Spectroscopy
Abstract Flip chip solder bumps were produced on Cu contact applying Sn-9Zn-xAl Pb-free solder by dipping method. The solder bumps were tested under 85 C/85% RH (relative humidity) or at 150 C for 1000 hours to explore the shear strength and the interfacial interaction behavior. Experimental results revealed that Al and Zn, while not Sn, diffuse to the Cu/solder interface during the extended period test. A thin layer of Al$_{4.2}$Cu$_{3.2}$Zn$_{0.7}$ compound, characterized by XRD, was formed at the interface of the as-produced solder bump. This compound which resulted from the gathering of Al at the interface, provides a barrier to Sn diffusion toward Cu substrate and, thus, no Cu-Sn compound was detected. This is the first time to find a Sn-containing solder which, in contact with Cu, does not form Cu-Sn intermetallic compound during heat treatment and, thus, the Sn-Zn-Al solder is termed an inherent barrier solder.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2001-01-01
Publisher Place New York
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 30
Issue Number 9
Page Count 5
Starting Page 1068
Ending Page 1072


Open content in new tab

   Open content in new tab
Source: SpringerLink