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Author Dybkov, V. I.
Source SpringerLink
Content type Text
Publisher Springer US
File Format PDF
Copyright Year ©2009
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword Earth Sciences ♦ Environment ♦ Physics ♦ Chemistry/Food Science ♦ Engineering ♦ Materials Science
Abstract During soldering, intermetallic layers can occur at the interface of a solid metal and the saturated or undersaturated solder melt. In systems with a considerable solubility in the liquid state, dissolution causes a manifold drop in layer thickness. Mathematical equations are proposed to evaluate the thickness of any intermetallic layer formed under conditions of simultaneous dissolution in the undersaturated solder melt. The main features of reactive phase formation at the solid metalliquid solder interface are illustrated using the Co-Sn couple with the growing CoSn$_{3}$ (250°C) and CoSn$_{2}$ (350°C and 450°C) layers as examples.
ISSN 10474838
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2009-01-23
Publisher Institution The Minerals, Metals & Materials Society (TMS)
Publisher Place Boston
e-ISSN 15431851
Journal JOM
Volume Number 61
Issue Number 1
Page Count 4
Starting Page 76
Ending Page 79


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Source: SpringerLink