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Author Lucas, J. P. ♦ Guo, F. ♦ McDougall, J. ♦ Bieler, T. R. ♦ Subramanian, K. N. ♦ Park, J. K.
Source SpringerLink
Content type Text
Publisher Springer-Verlag
File Format PDF
Copyright Year ©1999
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Chemistry & allied sciences
Subject Keyword Sn-Ag solder ♦ creep deformation behavior ♦ Cu$_{6}$Sn$_{5}$ intermetallic reinforcements ♦ Optical and Electronic Materials ♦ Characterization and Evaluation of Materials ♦ Electronics and Microelectronics, Instrumentation ♦ Solid State Physics and Spectroscopy
Abstract Creep deformation behavior was measured for 60–100 µm thick solder joints. The solder joints investigated consisted of: (a) non-composite solder joints made with eutectic Sn-Ag solder, and (b) composite solder joints with eutectic Sn-Ag solder containing 20 vol. %, 5 µm diameter in-situ Cu$_{6}$Sn$_{5}$ intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1999-01-01
Publisher Place New York
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 28
Issue Number 11
Page Count 6
Starting Page 1270
Ending Page 1275

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Source: SpringerLink