Access Restriction

Author Kariya, Yoshiharu ♦ Otsuka, Masahisa
Source SpringerLink
Content type Text
Publisher Springer-Verlag
File Format PDF
Copyright Year ©1998
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Chemistry & allied sciences
Subject Keyword Crack propagation ♦ ductility ♦ fatigue life ♦ isothermal fatigue ♦ lead free solder ♦ reliability ♦ Sn-3.5Ag ♦ Sn-Ag-Bi ♦ Sn-Ag-Cu ♦ Sn-Ag-Zn ♦ Sn-Ag-In ♦ Optical and Electronic Materials ♦ Characterization and Evaluation of Materials ♦ Electronics and Microelectronics, Instrumentation ♦ Solid State Physics and Spectroscopy
Abstract In our previous study, the fatigue life of Sn-3.5Ag-Bi alloy was found to be dominated by the fracture ductility of the alloy and to obey a modified Coffin-Manson’s law: (Δε$_{p}$/2D)· N f α , where Δε$_{p}$ is plastic strain range, N$_{f}$ is fatigue life, and α and=C are nondimensional constants. In this study, copper, zinc, and indium are selected as the third element, and the effect of these elements on the isothermal fatigue properties of Sn-3.5%Ag alloy has been investigated. The relationship between fatigue life and crack propagation rate estimated from load drop curve during fatigue test is also discussed. The addition of copper, indium, and zinc up to 2% slightly decreases the fatigue life of Sn-3.5Ag alloy due to the loss of ductility, while the life still remains higher than that of tin-lead eutectic alloy. The modified Coffin-Manson’s equation can also be applied to ternary Sn-3.5Ag-X. It is found that both ductility and fatigue life are significantly responsible for the load drop rate of the alloy, which reflects the extent of crack propagation. The fatigue life of Sn-3.5Ag-X alloy is therefore dominated not by the kinds and amount of third element but by the ductility of each alloy.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1998-01-01
Publisher Place New York
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 27
Issue Number 11
Page Count 7
Starting Page 1229
Ending Page 1235

Open content in new tab

   Open content in new tab
Source: SpringerLink