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Author Kim, Kyung Seob ♦ Kim, Nam Kyu ♦ Yu, Chung Hee ♦ Kim, Joong Jung ♦ Chang, Eui Goo
Source SpringerLink
Content type Text
Publisher Springer-Verlag
File Format PDF
Copyright Year ©2004
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Chemistry & allied sciences ♦ Technology ♦ Engineering & allied operations
Subject Keyword Solder bump ♦ stud bump ♦ photo-diode ♦ thermal aging ♦ intermetallic compound ♦ Optical and Electronic Materials ♦ Characterization and Evaluation of Materials ♦ Electronics and Microelectronics, Instrumentation ♦ Solid State Physics and Spectroscopy
Abstract The joint strength and fracture surfaces of Sn-Pb and Au stud bumps for photodiode packages after isothermal aging were studied experimentally. Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joint strength decreased with aging time. The diffraction patterns of Cu$_{6}$Sn$_{5}$, scallop-shaped IMCs, and planar-shaped Cu$_{3}$Sn were characterized by transmission electron microscopy (TEM). The IMCs between Au stud bumps and Al pads was identified as AlAu$_{2}$. The formation of Kirkendall voids and the growth of IMCs at the solder joint were found to be a possible mechanism for joint strength reduction.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2004-01-01
Publisher Place New York
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 33
Issue Number 1
Page Count 6
Starting Page 70
Ending Page 75


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Source: SpringerLink