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Author Jeong, Nyeon Ho ♦ Han, Sang Chul ♦ Han, Young Hee ♦ Sung, Tae Hyun ♦ Yoon, Jung Hyun ♦ Lee, Chi Woo
Source SpringerLink
Content type Text
Publisher Springer US
File Format PDF
Copyright Year ©2007
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Chemistry & allied sciences
Subject Keyword Bi-2212 ♦ thick films ♦ screen-printing ♦ electric properties ♦ Ni tapes ♦ Solid State Physics and Spectroscopy ♦ Electronics and Microelectronics, Instrumentation ♦ Characterization and Evaluation of Materials ♦ Optical and Electronic Materials
Abstract We studied the formation of Bi$_{2}$Sr$_{2}$CaCu$_{2}$O$_{ x }$(Bi-2212) and Bi$_{2}$Sr$_{2}$Ca$_{2}$Cu$_{3}$O$_{ x }$(Bi-2223) thick films in a heat treatment process of the Ni-sheathed Bi-Sr-Ca-Cu-O (BSCCO) system. Cu was electrodeposited initially on the Ni substrates (Cu/Ni). Well-oriented Bi-2212 superconductor thick films were formed successfully on Ni tapes by liquid reaction between Cu-free precursors and Cu/Ni tapes. However, only a small amount of Bi-2223 was formed. Thick films were prepared by screen-printing with Bi$_{2}$O$_{3}$, SrCO$_{3}$, and CaCO$_{3}$ powders on Cu/Ni tapes and heat treating them. Heat treatment was performed in the temperature range of 750–850°C in a tube furnace for several minutes to hours. The phases and the microstructures of the high temperature superconductor thick films were analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM), respectively. Electrical properties were examined by the standard four-probe method. At the heat treatment temperature, the specimens were in a partially molten state during reaction between the oxidized copper layer and the screen-printed precursors on the Cu/Ni tapes.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-07-31
Publisher Place Boston
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 36
Issue Number 10
Page Count 4
Starting Page 1299
Ending Page 1302

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Source: SpringerLink