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Author Yu, H. ♦ Vuorinen, V. ♦ Kivilahti, J. K.
Source SpringerLink
Content type Text
Publisher Springer US
File Format PDF
Copyright Year ©2007
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Chemistry & allied sciences
Subject Keyword Solder ♦ interfacial reaction ♦ interconnection ♦ Solid State Physics and Spectroscopy ♦ Electronics and Microelectronics, Instrumentation ♦ Characterization and Evaluation of Materials ♦ Optical and Electronic Materials
Abstract In order to obtain a better understanding of the effects of interconnection microstructures on the reliability of soldered assemblies, one of the most important ternary systems used in electronics, the Sn-Cu-Ni system, has been assessed thermodynamically. Based on the data obtained, some recent experimental observations related to the formation of interfacial intermetallic compounds in solder interconnections have been studied analytically. First, the effect of Cu content on the formation of the interfacial intermetallic compounds between the SnAgCu solder alloys and Ni substrate was investigated. The critical Cu content for (Cu,Ni)$_{6}$Sn$_{5}$ formation was evaluated as a function of temperature. Second, we analyzed how the Ni dissolved in the Cu$_{6}$Sn$_{5}$ compound affects the driving forces for the diffusion of components and hence the growth kinetics of (Cu,Ni)$_{6}$Sn$_{5}$ and (Cu,Ni)$_{3}$Sn reaction layers. With the thermodynamic description, other experimental observations related to the Sn-Cu-Ni system can be rationalized as well. The system can be used also as a subsystem for industrially important higher order solder systems.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-01-17
Publisher Place Boston
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 36
Issue Number 2
Page Count 11
Starting Page 136
Ending Page 146

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Source: SpringerLink