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Author Hacke, P. L. ♦ Fahmy, Y. ♦ Conrad, H.
Source SpringerLink
Content type Text
Publisher Springer-Verlag
File Format PDF
Copyright Year ©1998
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Chemistry & allied sciences
Subject Keyword Annealing ♦ coarsening ♦ fatigue crack growth rate ♦ interphase diffusion ♦ phase size ♦ thermo-mechanical fatigue ♦ Optical and Electronic Materials ♦ Characterization and Evaluation of Materials ♦ Electronics and Microelectronics, Instrumentation ♦ Solid State Physics and Spectroscopy
Abstract The effects of phase coarsening in 63Sn37Pb solder joints produced by isothermal annealing and during thermo-mechanical cycling (TMC) on the fatigue cracked area growth rate dA$_{c}$/dN were investigated. The phase coarsening by isothermal annealing was in accord with the mechanism of interphase boundary diffusion; that during TMC was significantly greater than by isothermal annealing. The phase coarsening in the range considered (D=1–5 µm, N<150 cycles) had only little, if any, influence on dA$_{c}$/dN, which occurred mainly in Stage I of the fatigue crack growth rate regime. Results obtained previously, however, indicate that for N>150 cycles dA$_{c}$/dN is significantly decreased by a reduction in the as-reflowed phase size. Reasonable agreement occurred between the calculated fatigue lifetime vs initial as-reflowed phase size and that measured.
ISSN 03615235
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1998-01-01
Publisher Place New York
e-ISSN 1543186X
Journal Journal of Electronic Materials
Volume Number 27
Issue Number 8
Page Count 7
Starting Page 941
Ending Page 947

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Source: SpringerLink