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Author Stack, A. Dic Chip ♦ Ni, Min ♦ Su, Qing ♦ Tang, Zongwu ♦ Kawa, Jamil
Source CiteSeerX
Content type Text
File Format PDF
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword Thermal Tsvs ♦ Analytical Study ♦ Overall Average Temperature ♦ Compact Thermal Model Simulator ♦ Thermal Tsv Count ♦ Ic Vertical Stack ♦ Lateral Thermal Gradient ♦ Initial Boundary Condition
Abstract Abstract — This paper analyzes the effectiveness of the use of thermal TSVs in lowering the overall average temperature of a 3D IC vertical stack as well as the impact and significance of thermal TSV count on the vertical and lateral thermal gradients in the stack for a given set of initial boundary conditions. A set of simulations were carried out using a 3DIC compact thermal model simulator on a multi-tier multi-die 3DIC design to access these effects of thermal TSVs.
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research
Education Level UG and PG ♦ Career/Technical Study
Learning Resource Type Article