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Source CiteSeerX
Content type Text
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Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword Ball Pitch ♦ Micron Bga Part ♦ Bga Manufacturer ♦ User Guide ♦ Package Height ♦ Package Descriptor F1 ♦ Detailed Ball Pitch Information ♦ Many Memory Manufacturer
Abstract For example: TFBGA = 1.2mm package height and less than 1.0mm ball pitch. Package descriptors F1 through F6 have been added to provide more detailed ball pitch information for devices with a ball pitch of less than 0.8mm. Within the industry, many memory manufacturers continue to use only the “F ” descriptor for any ball pitch of
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research
Education Level UG and PG ♦ Career/Technical Study