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Author Szekely, Vladim R. ♦ Rencz, Marta
Source CiteSeerX
Content type Text
File Format PDF
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword Digital Output Signal ♦ Built-in Temperature Sensor ♦ Experimental Realization ♦ Thermal Test ♦ Built-in Test Circuit ♦ New-concept Temperature Sensor Element ♦ Encapsulated Device Insertion ♦ Microelectronic Structure ♦ Thermal-feedback Oscillator ♦ Temperature Sensor ♦ Microelectronic Unit ♦ Great Interest ♦ Tfo Temperature Sensor ♦ Possible Solution ♦ Thermal State ♦ Life-time Thermal Monitoring
Description We present possible solutions for the life-time thermal monitoring of microelectronic structures. In order to grab the thermal state of an encapsulated device insertion of one or more temperature sensors is proposed. A new-concept temperature sensor element is introduced: the thermal-feedback oscillator (TFO). The TFO has digital output signal and therefore is suitable for being integrated with other built-in test circuits, such as the boundary-scan. Results of the experimental realization of the TFO temperature sensor are presented 2. 1 Built-in Temperature Sensors The thermal state of microelectronic units has always been a question of great interest. Increasing efforts
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research
Education Level UG and PG ♦ Career/Technical Study
Learning Resource Type Article
Publisher Date 1995-01-01
Publisher Institution In Proc. of ED&TC'95