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Author Xiang, Dong ♦ Shen, Kele
Source ACM Digital Library
Content type Text
Publisher Association for Computing Machinery (ACM)
File Format PDF
Copyright Year ©2014
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword Hotspot ♦ Temperature ♦ Test ordering ♦ Thermal-driven test application ♦ Three-dimensional ICs
Abstract The three-dimensional (3-D) technology offers a new solution to the increasing density of integrated circuits (ICs). In this work, we propose novel scan architectures for 3-D IC pre-bond and post-bond testing by considering the interconnection overhead of through-silicon-vias (TSVs). Since hotspots in 3-D ICs often cause performance and reliability issues, we also develop different test ordering schemes for prebond and postbond testing to avoid applying test vectors that could worsen the temperature distribution. Experimental results show that the peak temperature can be lowered by 20% with the 3-D scan tree architecture. When combined with the test ordering scheme, the 3-D scan tree can further reduce peak temperature by over 30%.
ISSN 15504832
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-03-06
Publisher Place New York
e-ISSN 15504840
Journal ACM Journal on Emerging Technologies in Computing Systems (JETC)
Volume Number 10
Issue Number 2
Page Count 19
Starting Page 1
Ending Page 19


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Source: ACM Digital Library