|Author||Paulus, Wilfred ♦ Rahman, Irman Abdul ♦ Jalar, Azman ♦ Kamil, Insan ♦ Bakar, Maria Abu ♦ Yusoff, Wan Yusmawati Wan|
|Source||United States Department of Energy Office of Scientific and Technical Information|
|Subject Keyword||MATERIALS SCIENCE ♦ COPPER ADDITIONS ♦ DISLOCATIONS ♦ GAMMA RADIATION ♦ HARDNESS ♦ IRRADIATION ♦ MONITORING ♦ RADIATION DOSES ♦ RADIATION HARDENING ♦ RELIABILITY ♦ SILVER ALLOYS ♦ SOLDERED JOINTS ♦ SURFACES ♦ TIN BASE ALLOYS|
|Abstract||Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.|
|Learning Resource Type||Article|
|Publisher Place||United States|
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